Akasa T5 Pro-Grade+ heat sink compound Thermal paste 5.2 W/m·K 5 g

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Akasa T5 Pro-Grade+ heat sink compound Thermal paste 5.2 W/m·K 5 g

Achieve outstanding thermal transfer for your CPU or GPU with the Akasa T5 Pro-Grade+ heat sink compound. Engineered with a unique blend of hybrid silicone and nano-diamond particles, this premium thermal paste delivers an exceptional thermal conductivity of 5.2 W/m·K, ensuring your processor runs cooler and more reliably even under heavy loads. Its advanced formulation provides long-lasting performance without the need for reapplication, making it an ideal choice for enthusiasts, overclockers, and professional system builders.

- Hybrid silicone and nano-diamond particle technology for ultra-efficient heat dissipation

- Thermal conductivity rated at 5.2 W/m·K for superior thermal transfer

- Non-curing formula ensures consistent performance over time without hardening

- Non-electrically conductive, eliminating risk of short circuits on sensitive components

- Conveniently packaged in a 5 gram syringe for precise and mess-free application

- Suitable for use with all modern CPU and GPU coolers

Whether you are building a new system or upgrading an existing one, the Akasa T5 Pro-Grade+ offers the reliability and thermal efficiency you need to keep your hardware performing at its best.

GTIN: 4710679550817