Cooler Master CryoFuze heat sink compound Thermal paste 14 W/m·K 2 g

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Cooler Master CryoFuze heat sink compound Thermal paste 14 W/m·K 2 g

Cooler Master CryoFuze thermal paste delivers exceptional heat transfer for high-performance CPUs and GPUs, ensuring your system stays cool under heavy loads. With a thermal conductivity rating of 14 W/m·K, this non-electrically conductive compound bridges microscopic gaps between the heat sink and processor, reducing thermal resistance and maximising efficiency. Whether you are overclocking, building a silent workstation, or maintaining a gaming rig, CryoFuze provides the reliable bonding you need for sustained peak performance.

- Thermal conductivity of 14 W/m·K for superior heat dissipation

- Non-electrically conductive formula ensures safe application on sensitive components

- Long-lasting stability with low bleed and low evaporation for extended service life

- Easy to apply with a smooth, consistent consistency for even coverage

- 2 g syringe provides enough paste for multiple applications or a single high-end build

- Wide operating temperature range suitable for demanding environments

Trusted by enthusiasts and professionals alike, CryoFuze is the ideal thermal interface solution for keeping your hardware running at its best.

GTIN: 4719512120415