Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/mK

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Cooler Master HTK-002 Heat Sink Compound Thermal Paste 4.5 W/mK

Designed to maximise heat dissipation between your processor and cooler, this thermal paste ensures efficient thermal transfer that helps maintain lower operating temperatures, reduces the risk of thermal throttling, and extends the lifespan of your hardware. Whether you are building a new PC or reapplying paste during maintenance, the Cooler Master HTK-002 delivers reliable, long-lasting performance for both everyday computing and intensive workloads.

- Thermal conductivity rating of 4.5 W/mK for effective heat transfer

- Silicone-based grease heavily filled with heat conductive metal oxides

- Non-electrically conductive formula, safe for use on sensitive components

- Easy to apply with a smooth consistency that spreads evenly

- Stable over a wide temperature range, resisting drying or cracking over time

- Suitable for CPUs, GPUs, and other heat-generating chipsets

- Standard 1.5g syringe packaging for precise application

Optimise your system's cooling and get the most from your hardware with this dependable thermal compound.

GTIN: 4719512002940